Wednesday, September 15, 2021
10:00-10:45AM CDT / 5:00-5:45PM CEST

Deployment of the 5G network means increased demand for handling larger-than-ever quantities of data at faster-than-ever speeds, and through increasingly-smaller wired and wireless devices.

The critical link: high-speed connectors that balance new, advanced technologies against costs  while ensuring that data communications infrastructure meets current and future demand.

High-speed connector performance begins with the materials used to build it. The experts at Celanese have engineered thermoplastic solutions to support your biggest design challenges.

Join us for this web seminar to learn about our portfolio of solutions for high-speed connectors:

  • High performance solution for 5G electronics
  • Tunable Dk/Df with Zenite® LCP for whole data server system impedance matching
  • Low Dk/Df Zenite® LCP for signal integrity
  • CAE capability for electromagnetic analysis



Speaker

Learn from the expert:

Dr. Young Kim

Senior Principal Engineer

Dr. Kim holds a Ph.D. in material science and engineering from the University of Delaware. He has commercialized more than 15 new products in the electronics and automotive industries and filed more than 50 patents in engineering and conductive plastics. He has published several technical papers in peer-reviewed journals.


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