Deployment of the 5G network means increased demand for handling larger-than-ever quantities of data at faster-than-ever speeds, and through increasingly-smaller wired and wireless devices.

The critical link: high-speed connectors that balance new, advanced technologies against costs  while ensuring that data communications infrastructure meets current and future demand.

High-speed connector performance begins with the materials used to build it. The experts at Celanese have engineered thermoplastic solutions to support your biggest design challenges.

Join us for this web seminar to learn about our portfolio of solutions for high-speed connectors:

  • High performance solution for 5G electronics
  • Tunable Dk/Df with Zenite® LCP for whole data server system impedance matching
  • Low Dk/Df Zenite® LCP for signal integrity
  • CAE capability for electromagnetic analysis



Speakers

Learn from the following experts:

Dr. Young Kim

Senior Principal Engineer


Young Kim received an Ph.D Degree in material science and engineering at the University of Delaware.

Currently, he is senior principal engineer at Celanese. He has commercialized more than fifteen new products in electronics and automotive. For the last 20 years, he published more than 13 technical papers in peer-reviewed journals and has more than 50 patents filed in engineered plastics area.