Solution Showcase
Low Density Solutions to Power Lighter, Smarter Consumer Electronics

If you need to reduce the weight of your electronic devices while maintaining the strength and flexibility needed to support evolving designs, our low-density solutions can meet all these requirements.

The latest member of our low-density family, Zytel® FE170073, has been proven to reduce around 28% of the weight of smartphone components compared to those using traditional materials. It features:

  • High flowability
  • Outstanding mechanical strength
  • Dimensional stability
  • Chemical resistance
  • Laser Enhanced Plating (LEP) compatibility
  • Dielectric properties

Download the solution showcase to find out more about this low-density, high modulus material and how Celanese technical experts can support you on part and tool design to ensure the materials deliver superior performance.

Celanese BioPolymer Solutions
The Best Packaging Solutions Begin + Return to Nature


This website uses 'cookies' to give you the best, most relevant experience. Using this website means you are Ok with this. You can change which cookies are set at any time - and find out more about them - by following this link.

Information on the processing of your personal data within the USA by Google and Marketo:
By clicking "Accept All", or selecting "Marketing" and/or "Analytical" and then clicking "Accept Selected", you also consent in accordance with Art. 49(1)(a) GDPR that your data may be processed in the USA. The USA is considered by the European Court of Justice to be a country with no adequate level of data protection according to EU standards. In particular, there is a risk that your data may be processed by US authorities for surveillance and investigation purposes, possibly without the opportunity for legal remedies. If you select “Necessary” and then click on "Accept Selected”, the transfer described above will not take place. You will find more detailed information in our privacy policy.